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分会介绍

D11-Electronic Materials and Microsystems

Update time:2024-03-04 16:19

Covering dielectric, piezoelectric, ferroelectric, multiferroic materials, optoelectronic, semiconductor, metamaterials, thermoelectric materials, nanomaterials, thin film/thick film and related bulk electronic devices, 3D printing modules, marine materials and devices and other emerging fields, it includes their preparation/synthesis, characterization, structure, physicochemical properties and applications.


Zhou Yichun            Xidian University 
Li Jingfeng              Tsinghua University
Huo Zongliang         Yangtze Memory
Wang Xiaohui          Tsinghua University
Lu Zhenya               South China University of Technology
Gao Xingsen            South China Normal University


Shi Feng                 Qilu University of Technology (Shandong Academy of Sciences)

18853227408

sf751106@163.com




Important Dates
 Conference Date:

July 8-11, 2024


 Abstract Submission Deadline:

May 21, 2024

May 24, 2024


 Early Bird Registration:

June 21, 2024