Language: 简体中文 English
分会介绍

D36-Thermal Management Materials

Update time:2024-03-05 14:37

This session collects academic papers in the field of thermal management materials, including but not limited to thermal interface materials, thermal conductive films, thermal conductive composites, thermal smart materials, phase change materials, semiconductor heterojunction materials, thermal insulation materials, and other related fields.


Cao Bingyang          Tsinghua University

Tang Guihua            Xi’an Jiaotong University

Feng Wei                 Tianjin University

Gu Junwei                Northwestern Polytechnical University

Song Bai                  Peking University




Zhang Xudong         Tsinghua University

18811345210

zhangxudong@mail.tsinghua.edu.cn







Important Dates
 Conference Date:

July 8-11, 2024


 Abstract Submission Deadline:

May 21, 2024

May 24, 2024


 Early Bird Registration:

June 21, 2024